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LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
LED ARRAY
Pb
Lead-Free Parts
LA44B/SGMVY.DBK-S2-PF
DATA SHEET
DOC. NO : QW0905- LA44B/SGMVY.DBK-S2-PF REV. DATE : : A 03 - Sep. - 2007
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LA44B/SGMVY.DBK-S2-PF Page 1/7
Package Dimensions
4.4 3.00.5 9.0
3.0X2
SGMVY
5.0
3.4X2
9.65
2.65
DBK
3.30.25
0.5 TYP
2.54TYP
SGM
5.050.5
2.540.5
+
1
2 1 VY 2
LDBK2340
LSGMVY2362
3.0
3.0
5.0 1.5MAX 1.5MAX
5.0
25.0MIN
25.0MIN
0.5 TYP
1.0MIN
0.5 TYP
1.0MIN
SGM VY 1 2
2.54TYP
2.54TYP
+
-
1
2
Note : 1.All dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.Specifications are subject to change without notice.
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LA44B/SGMVY.DBK-S2-PF Page 2/7
Absolute Maximum Ratings at Ta=25
Ratings Parameter Symbol SGM Forward Current Peak Forward Current Duty 1/10@10KHz Power Dissipation Reverse Current @5V Electrostatic Discharge( * ) Operating Temperature Storage Temperature IF IFP PD Ir ESD Topr Tstg 30 100 100 50 1000 VY 30 60 75 10 2000 -20 ~ +80 -30 ~ +100 DBK 30 100 120 50 150 mA mA mW UNIT
A V
Static Electricity or power surge will the Use of anti-electrosatic * glove is recommended when handingdamageLED.LED.devices, a conductive wrist band or must be properly these All equipment and machinery grounded.
Typical Electrical & Optical Characteristics (Ta=25 )
PART NO
COLOR MATERIAL Emitted InGaN/SiC Green White Diffused Lens
Peak Dominant Spectral Forward wave halfwidth voltage wave length length nm @ 20mA(V)
Pnm Dnm
Luminous Viewing intensity angle @20mA(mcd) 2 1/2 (deg)
Min. Typ. Max. Min. Typ. 518 --525 590 470 35 20 30 --3.5 4.2 120 220 2.6 120 220 100 100 36
LA44B/SGMVY.DBK-S2-PF
AIGaInP
Yellow Blue Diffused
1.7 -----
InGaN/GaN Blue
---
3.5 4.0 350 700
Note : 1.The forward voltage data did not including 0.1V testing tolerance. 2. The luminous intensity data did not including 15% testing tolerance.
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LA44B/SGMVY.DBK-S2-PF Page 3/7
Typical Electro-Optical Characteristics Curve
SGM CHIP
Fig.1 Forward current vs. Forward Voltage Fig.2 Forward Current vs. Relative Intensity
2.5
30
Forward Current(mA)
Forward Current(mA)
1.0 1.5 2.0 2.5 3.0 3.5 4.0
2.0 1.5 1.0 0.5 0.0 0
20
10
0
10
20
30
40
50
Forward Voltage(V) Fig.3 Forward Current vs. Temperature
60 50 40 30 20 10 0 0 20 40 60 80 100
Relative Intensity Normalize @20mA Fig.4 Relative Intensity vs. Temperature
Relative Intensity@20mA Normalize @25
Forward Current@20mA
2.0
1.5
1.0
0.5 0.0 20 30 40 50 60 70
Ambient Temperature()
Ambient Temperature()
Fig.5 Relative Intensity vs. Wavelength
Relative Intensity@20mA
1.0
0.5
0.0 450
500
550
600
Wavelength (nm)
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LA44B/SGMVY.DBK-S2-PF Page4/7
Typical Electro-Optical Characteristics Curve
VY CHIP
Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current
1000
3.0
Forward Current(mA)
100 10
Relative Intensity Normalize @20mA
1.5 2.0 2.5 3.0
2.5 2.0 1.5 1.0 0.5 0.0 1.0 10 100 1000
1.0 0.1 1.0
Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature
1.2
Forward Current(mA) Fig.4 Relative Intensity vs. Temperature
3.0
Forward Voltage@20mA Normalize @25
Relative Intensity@20mA Normalize @25
1.1
2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 100
1.0
0.9
0.8 -40 -20 0 20 40 60 80 100
Ambient Temperature()
Ambient Temperature()
Fig.5 Relative Intensity vs. Wavelength
1.0
Relative Intensity@20mA
0.5
0.0 500 550 600 650
Wavelength (nm)
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LA44B/SGMVY.DBK-S2-PF Page 5/7
Typical Electro-Optical Characteristics Curve
DBK CHIP
Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current
3.0
1000
Forward Current(mA)
100 10 1 01 1.0 2.0 3.0 4.0 5.0
Relative Intensity Normalize @20mA
2.5 2.0 1.5 1.0 0.5 0.0 1 10 100 1000
Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature
Forward Current(mA) Fig.4 Relative Intensity vs. Temperature
Forward Voltage@20mA Normalize @25
Relative Intensity@20mA Normalize @25
-40 -20 0 20 40 60 80 100
1.2
3.0 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 100
1.1 1.0
0.9
0.8
Ambient Temperature()
Ambient Temperature()
Fig.5 Relative Intensity vs. Wavelength
Relative Intensity@20mA
1.0
0.5
0.0 400 450 500 550
Wavelength (nm)
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LA44B/SGMVY.DBK-S2-PF Page 6/7
Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to case)
2.Wave Soldering Profile Dip Soldering Preheat: 120C Max Preheat time: 120seconds Max Ramp-up 2 C/sec(max) Ramp-Down:-5C/sec(max) Solder Bath:260 C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to case)
Temp( C) 260 C3sec Max
260
5 /sec max
120
2 /sec max
25 0
0
Preheat 120 Seconds Max
100
200
250
Time(sec)
Note: 1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above.
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LA44B/SGMVY.DBK-S2-PF Page 7/7
Reliability Test:
Test Item
Test Condition
1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs)
Description
This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed.
Reference Standard
MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1
Operating Life Test
High Temperature Storage Test
1.Ta=105 5 2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of the device which is laid under condition of high temperature for hours.
MIL-STD-883:1008 JIS C 7021: B-10
Low Temperature Storage Test
1.Ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of the device which is laid under condition of low temperature for hours.
JIS C 7021: B-12
High Temperature High Humidity Test
1.Ta=65 5 2.RH=90 %~95% 3.t=240hrs 2hrs
The purpose of this test is the resistance of the device under tropical for hours.
MIL-STD-202:103B JIS C 7021: B-11
Thermal Shock Test
1.Ta=105 5&-405 (10min) (10min) 2.total 10 cycles
The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire.
MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011
Solder Resistance Test
1.T.Sol=260 5 2.Dwell time= 10 1sec.
MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1
Solderability Test
1.T.Sol=230 5 2.Dwell time=5 1sec
This test intended to see soldering well performed or not.
MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2

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